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SK Hynix to build AI chip packaging facility in Indiana

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SK Hynix,AI Chip,Packaging Fabrication

South Korean company SK Hynix plans to construct a packaging fabrication and R&D facility for its next-generation AI chip products in Indiana. The facility is expected to create a thousand jobs and align with the Biden administration's goal of boosting domestic chip production.

The South Korean firm SK Hynix has announced plans to build a packaging fabrication and R&D facility for its next-generation AI chip products in West Lafayette, Indiana. The facility, expected to be operational in 2028, will create a thousand jobs and align with the Biden administration's goal of boosting domestic chip production. The facility will house a production line for SK Hynix's high-bandwidth memory chips, which are crucial components in AI systems.

This move aims to strengthen supply-chain resilience and develop a local semiconductor ecosystem

 

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